The instances are powered by the HGX A100 16-GPU platform, which combines two HGX A100 8-GPU baseboards using... Read more…, Microsoft Azure continues to infuse its cloud platform with HPC- and AI-directed technologies. @jeffkibuule There are some Tripp-lite models that could be considered too.. Intel's AgileX comes brimming with next-gen tech, like support for PCIe 5.0, DDR5, HBM3, Optane Memory DIMMs, and memory coherency with Xeons. But if I'm being honest, the CPM for ads is so poor… https://t.co/E2p6WrexBL, @acwroy It's something that I want to do. Out of these, the cookies that are categorized as necessary are stored on your browser as they are essential for the working of basic functionalities of the website. Intel's AgileX comes brimming with next-gen tech, like support for PCIe 5.0, DDR5, HBM3, Optane Memory DIMMs, and memory coherency with Xeons. Intel also looks to extend its transceiver leadership with 112G transceivers. You also have the option to opt-out of these cookies. We'll assume you're ok with this, but you can opt-out if you wish. Intel isn't releasing Hyperflex 2 architecture specifics but says that AgileX will be up to 40% faster than Stratix 10 or consume 40% less power. Intel N3710 1.6 GHz (turbo 2.56 GHz) Memory: System memory: 8 GB SODIM DDR3L-1600 Mass storage: 128 GB SATA uSSD: Battery: Internal battery capacity: 7.4 V typ. Some of the chiplet suggestions from Intel include High Bandwidth Memory (HBM), next-generation 112G transceivers, PCIe Gen 5.0 root complexes, Compute eXpress Link interfaces (through PCIe 5.0), additional CPU cache coherent interconnects, and other chiplets/IP as determined by the customer. Possibly these issues will be resolved on that node as they are not going to be relying on multi patterning as much on that node. In-Depth on AgileX: Intel Making FPGAs Accessible. Who's going to risk a product line on them without serious market development cash? This new range of products is set to roll out later this year for sampling, and offer a mix of analog, digital, memory, custom IO, and eASIC variations within a singular platform. Intel has also doubled its DSP capabilities, providing 20 TFLOPS of single-precision or 40 TFLOPS of half-precision performance. The Agilex FPGA builds on similar design principles to the Stratix – a centralized FPGA block of gates with hardened features and external connections out to several different technologies, based on the customer requirements. First and foremost, AgileX will provide a welcome boost in performance. So this means this chip does not have designed issues in Cannon Lake. The Cray brand will live on, encompassing th Read more…, The biggest cool factor in server chips is the nanometer. The Intel Quartus Prime software will support these variants from April 2019, and first device availability of the F-series will be from Q3 2019. I think one needs to first look at this market, Altera was pretty much the leader of market - plus these are specialize products and perfect platform for Intel to test new process. @jaguar36 The alternative, I should add, is basically to turn the site into a shopping site so that we earn enough… https://t.co/mOq2ZNryB9, @jaguar36 I'm probably the biggest critic of our ad situation. Kiri… https://t.co/ffGOENFH3L, RT @anandtech: Compact ✅ These faster interfaces double or quadruple the data rate compared to PCIe 3.0. The use of PCIe Gen 5.0 is also a big element to Agilex, as it allows customers to connect directly with future PCIe 5.0 host devices, but it also allows for Intel’s new Compute eXpress Link technology, which builds upon the PCIe 5.0 physical standards. According to Intel, the customers will use Agilex FPGAs to develop networking, 5G and AI and accelerated data analytics solutions. To expand the interconnect beyond the confines of the chip, AgileX is compatible with both PCIe 4.0 and PCIe 5.0, though PCIe 5.0 support will come at a later date. Three family have been announced so far, although the later is shown as coming soon: The Intel Agilex family is built on Intel’s 10nm process and heterogeneous 3D silicon-in-package (SiP) technology based on Intel’s embedded multi-die interconnect bridge (EMIB) technology. Intel tells us that they are currently the only FPGA vendor shipping with 58G PAM-4 transceivers, while Xilinx is still on 28G. In-Depth on AgileX: Intel Making FPGAs Accessible, Any-to-Any Integration and Memory Coherency. 3 h Internal and external battery charging time: approx. The system, which weighs in at 415.5 Linpack petaflops, topp Read more…, © 2020 HPCwire. Solid & Rugged ✅ Also Intel put a much more competent team on building out 7nm.